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Proudly Made in the USA with Premium Standards

Lightning-Fast Production Turnaround Times

Exceptional Quality You Can Trust Every Time

Hotline: +1-702-502-8562

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PCB Manufacturing & Assembly

Origin: USA // High-Speed

PCB

Fabrication & Assembly

End-to-end electronic manufacturing for mission-critical applications. Specialized in multi-layer rigid boards, SMT, and through-hole technology.

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Status

ISO 9001:2015 CERTIFIED
FACILITY

Fabrication

Advanced Fabrication

Precision-engineered bare boards built to your exact specifications. Our processes utilize high-grade materials and laser-direct imaging.

Layer Stackup

  • Up to 32 Layers
  • Rigid-Flex Support
  • HDI Capabilities

Substrates

  • FR-4 High TG
  • Aluminum Core
  • Rogers / Teflon

Tolerances

  • 3 mil Trace/Space
  • +/- 0.1mm Drill
  • Controlled Impedance

Capabilities

High-Speed Assembly

Automated pick-and-place lines optimized for both rapid prototyping and high-volume production. We handle the complexity.

SMT Capabilities

01005 component placement, BGA/Micro-BGA expertise.

Through-Hole (THT)

Manual and wave soldering for heavy-duty power electronics.

Rapid Prototyping

Standard 24-48 hour turnaround for rapid engineering validation and functional testing.

Compliance Ready

Lead-free RoHS compliant assembly and cleanroom processing.

99.8%

First-Pass Yield

Protocols

Quality Systems & ITAR Compliance

We maintain the highest standards for defense, aerospace, and medical manufacturing. Our facilities are restricted and monitored.

ITAR

Registered & Compliant

IPC-A-610

Class 2 & 3 Certified

ISO 9001

Quality Management

AS9100D

Aerospace Standards

Inspection Protocols

  • Automated Optical Inspection (AOI) on all runs
  • 3D X-Ray Inspection for BGA and hidden joints
  • Flying Probe & In-Circuit Testing (ICT)
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Process

The Precision Process

From engineering review to final assembly, our controlled manufacturing workflow combines DFM expertise, precision solder deposition, and tightly managed reflow profiles to deliver reliable, production-ready electronics every time.
one

DFM Analysis

Every project undergoes a rigorous Design For Manufacturing review to optimize yield and reduce production costs.

two

Solder Paste Jetting

Precision stencil-less jetting for rapid prototypes or high-accuracy stencil printing for production runs.

three

Multi-Zone Reflow

Controlled thermal profiling ensures optimal solder joint integrity across varying component thermal masses.

Ready to build?

Upload your Gerber files and BOM for a comprehensive quote within 24 hours.

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average quote response time: 94 minutes